Effective January 1st 2022, ICE Enterprises will increase all product prices by 20%. Market forces, both rising component cost and increasing material lead time, are requiring the first price adjustment in company history. This price increase will allow ICE Enterprises to continue to design and manufacture quality electronic hardware as has been the case for over two decades. ICE Enterprises will honor all current price quotes and accept orders at existing pricing through the end of December 2021.

Processor Module Specifications

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Diagram

DTDMspecs.png

Pin Out and Mounting Standoffs

Connections for H1
(Samtec Pt# QTE-020-03-F-D-A)
Mounting Standoffs:
G1, G4 - Electrical Ground
P1, P2, P3, P4 - Power
(HH Smith Pt# - 9402F, Height: 7/16)
39 - VIN7 40 - VON7 P1 = 2.5V
37 - VIP7 38 - VOP7 P2 = 1.5V
35 - VIN6 36 - VON6 P3 = 3.3V
33 - VIP6 34 - VOP6 P4 = 12V
31 - VIN5 32 - VON5
29 - VIP5 30 - VOP5
27 - VIN4 28 - VON4
25 - VIP4 26 - VOP4
23 - VINC 24 - VONC
21 - VIPC 22 - VOPC
19 - VIN3 20 - VON3
17 - VIP3 18 - VOP3
15 - VIN2 16 - VON2
13 - VIP2 14 - VOP2
11 - VIN1 12 - VON1
9 - VIP1 10 - VOP1
7 - VIN0 8 - VON0
5 - VIP0 6 - VOP0
3 - TDI 4 - TDO
1 - TCK 2 - TMS